High quality FIDAFONE RMA-218 Flux Paste high quality Solder Flux for BGA solder station Soldering Tin Cream.
Model:RMA-218
Features:
The FIDAFONE RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.Good formula for BGA reballing / balls worksit can stick the balls much more.
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