XZ10 Series BGA Solder Balls 10K/Bottle, Sn63/Pb37, 183℃, Melting Point 0.2mm-0.76mm, For Repair

XZ10 Series BGA Solder Balls 10K/Bottle, Sn63/Pb37, 183℃, Melting Point 0.2mm-0.76mm, For Repair

Model Mechanic’s XZ10 Series Lead Free Solder Ball

Ability 10K pcs/bottle
Fusion point 217℃
Sn (tin) 96.5%
Ag (Silver) 3.0%
Cu (Cuprum) 0.5%
Asked For industrial use only
Net weight About 4.0-21.5g/pcs
Gross weight About 5.0-25.5g/pcs