Mechanic heat kit Reflow Soldering Heating Platform degumming/layering /Laminating /tin planting /welding for IPhone X-15Promax

د.م.2,100.00

The first heating platform in the mobile phone repair industry to apply reflow soldering technology

Using the principle of reflow curve heating, in which is realized curving heating welding by automatic

removing glue , remove motherboard , laminating motherboard , planting soldering paste and soldering functions from x to 13

Mechanic heat kit Reflow Soldering Heating Platform degumming/layering /Laminating /tin planting /welding for IPhone X-15Promax.

 

Double Ceramic Heating Element

The traditional single heating element is banned, and the new MCH ceramic double

heating element is adopted, which has faster heating, more uniform temperature

and stable performance.

In order to ensure stable product quality and performance, aging tests are required before leaving the

factory. There are slight color aging marks around the ceramic heating element and synthetic stone,

but it does not affect the normal use of product functions. Please buy with confidence!

5+3 Functional Modes

5 kinds of application scene modes of removing glue, layering, laminating, tin planting and

welding can be switched arbitrarily.3 commonly used memory temperatures

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Turbo Fan Cooling

Built-in strong wind cooling system, which allow the fan adapts to the

temperature to dissipate heat

3.4 inch colors creen display

3.4-inch HD color display, simple and easy-to-use UI interface.

Monitor temperature changes and realize reflow soldering temperature

curve data monitoring. Real-time detection of mainboard heating and

cooling temperature, no need to switch interface to view.

Understand product “details”

Let you have a comprehensive understanding of product details and

experience more comfortable

Specially designed for mobile phone mainboard componentsolder , curve

heating , intelligent and safe desoldering and reflow .

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