GSM CP-01 Motherboard Middle Layer Planting Tin Platform for iPhone X to 15Pro Max.
Features:
SGM CP-01 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15PLUS/15 PRO MAX/ 15 PRO MAX Beauty, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing
How to use:
Install the main board on the platform
Cover the BGA reballing stencil on the mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point
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