GSM CP-01 Motherboard Middle Layer Planting Tin Platform for iPhone X to 15Pro Max

د.م.170.00د.م.250.00

د.م.170.00
د.م.190.00
د.م.220.00
د.م.220.00
د.م.250.00

GSM CP-01 Motherboard Middle Layer Planting Tin Platform for iPhone X to 15Pro Max.

Features:

SGM CP-01 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15PLUS/15 PRO MAX/ 15 PRO MAX Beauty, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing

How to use:

Install the main board on the platform

Cover the BGA reballing stencil on the mainboard

Evenly spread tin on the cover of the reballing stencil

Remove the reballing stencil cover

Take out the motherboard and cooperate with the hot air gun to solidify the tin point

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