You are watching is the high viscosity no-clean AMTECH NC-599-ASM flux, It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. So, it will be a needed assistant on BGA reballing.
Features:
- Touch-up and rework
- Attachment of BGA spheres
- Soldering Flip Chip components
- Excellent wetting compatibility
- Wide reflow window
- Compatible with most board finishes
Specs details:
- Brand: Aemtech
- Sort: Lead-free and No-clean
- Weight: 100 g / bottle
- Shelf life: 1 year
- Storage: Keep refrigerated
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AMTECH It can be used for rework, sphere or pin attachment to BGA, PGA and CSP
packages, and assemble operations such as Flip Chip attachment to PWB
substrates. It is a necessary and helpful tool in BGA reballing.
NC-559-ASM solder paste has the following excellent points
1.Excellent capacity of solder-stickiness
2.Excellent Anti-wet Capacity
3.Widely used on BGA, PGA, CSP packages and Flip Chip Operation
4.Suitable for multiple PCB Reflow
5.No-clean and Lead free for Environmental protection
6. Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball.
7. For large-area hand-painted value balls (referring to chips), they need to be cleaned.
8. It is used for lattice value ball (such as CPU Socket on computer motherboard).
9. The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen (F / CL / Br / I) substances.
10. The welding paste has a moderate viscosity and a fine particle size, generally 2-5 μm. Suitable for hand brushes, Machine automatic printing and other processes.
11. It can be applied to both reflow soldering and manual value ball processes. Product main ingredients: imported rosin, active agent, organic solvent, thickener, preservative, etc. Related information: MSDS data, SGS report.
12.Clear and very clean
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